- 杨妍
- 副研究员
- 北京市朝阳区北土城西路3号
简 历：
教育背景
2011年 - 2015年，新加坡南洋理工大学 / 新加坡IME，博士，微电子学 / 光子学
工作简历
2015年 - 2016年，美国Inphi公司，高级研发工程师
2016年 - 2017年，美国Inphi公司，主任研发工程师
2017年 - 2018年，新加坡南洋理工大学，博士后研究员
2018年7月至今，中国科学院微电子所，集成电路先导工艺研发中心，副研究员，入选中国科学院“百人计划C”
社会任职： 研究方向：硅基光电子器件与集成，2.5D/3D硅基光电子集成 承担科研项目情况： 代表论著：
SCI Journal：
[1] Yan Yang, Xiaonan Hu, Junfeng Song, Qing Fang, Mingbin Yu, Xiaoguang Tu, Guo-Qiang Lo, and Rusli, “Thermo-optically tunable silicon AWG with above 600 GHz channel tunability,' IEEE Photonics Technology Letters, vol. 27, no. 22, pp. 2351-2354, 2015.
[2] Yan Yang, Qing Fang, Mingbin Yu, Xiaoguang Tu, Rusli, and Guo-Qiang Lo, “High efficiency Si optical modulator using Cu travelling-wave electrode”, Optics Express, vol. 22, no. 24, pp. 29978-29985, Nov. 2014.
[3] Yan Yang, Mingbin Yu, Rusli, Qing Fang, Junfeng Song, Liang Ding, and Guo-Qiang Lo, “Through-Si-via (TSV) keep-out-zone (KOZ) in SOI photonics interposer: a study of the impact of TSV-induced stress on Si ring resonators,' IEEE Photonics Journal, vol. 5, no. 6, p. 2700611, Oct. 2013.
International Conference：
[1] Yan Yang, Mingbin Yu, Qing Fang, Junfeng Song, Xiaoguang Tu, Guo-Qiang Lo, and Rusli, “3D silicon photonics packaging based on TSV interposer for high density on-board optics module,” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, Nevada, USA, 31 May – 3 June, 2016.
[2] Mingbin Yu,? Yan Yang,* Qing Fang, Xiaoguang Tu, Junfeng Song, King-Jien Chui, Rusli, and Guo-Qiang Lo, “3D electro-optical integration based on high-performance Si photonics TSV interposer,” in Optical Fiber Communication Conference (OFC), Anaheim, California, USA, 20-24 March 2016. (? * co-corresponding author)
[3] Yan Yang, Qing Fang, Mingbin Yu, Xiaoguang Tu, Junfeng Song, Rusli and Guoqiang Lo, “High-performance Si photonics interposer featuring RF travelling-wave electrode (TWE) via Cu-BEOL”, in Optical Fiber Communication Conference (OFC), paper Tu2A.6, Los Angeles, California, USA, 22-26 March 2015.
专利申请：
YANG Yan; Tan Chuan Seng; Tao Jing, Integrated 3D Architecture Of Si Photonics/TSV Interposer And Ion Trapping For Scalable Quantum Computing, Singapore Patent No. 10201800666V
获奖及荣誉：
